Top Picks in Hardware and Embedded Security
Co-located with the 2023 International Conference On Computer Aided Design (ICCAD 2023)
Top Picks recognizes the best of the best in hardware security, spanning the gamut from hardware to microarchitecture to embedded systems. Top Picks will be selected from hardware security papers that have appeared in leading conferences/journals, including but not limited to top security (e.g., IEEE S&P, CCS), architecture (e.g., ISCA, ASPLOS), CAD (e.g., ICCAD, DAC, DATE), and hardware security (e.g., CHES) venues.
After submission, papers will undergo a down select, whereby “shortlisted” papers will be invited to the Top Picks workshop, co-located with ICCAD 2023. An author(s) of each shortlisted paper is required to present the paper in-person at the workshop. A subset of these will be selected as Top Picks. Select papers are then invited for submission to a special journal issue at IEEE Design & Test.
The in-person Top Picks workshop is on November 1st, 2023
Eligible for submission are conference or journal papers in the area of hardware and embedded security that were published during the six-year period: 1/1/2017–12/31/2022.
A two-page self-nomination letter is required. The first page should summarize the key ideas/contributions to the paper. The second page should argue “for the potential of the work to have a long-term impact, clearly articulating why and how it will influence other researchers and/or industry.” The submission should follow the IEEE TCAD format.
Authors can submit their papers here: https://easychair.org/conferences/?conf=tphes2023
If the speaker only attends the workshop, select the option “Workshop Registration Only—$200”:
|Submission deadline:||September 8, 2023|
|Author notification||October 1, 2023|
|In-person presentation @ Top Picks Workshop||November 1, 2023|
|Top Picks announcement:||November 15, 2023|
|Top Picks submission to special journal issue:||December 15, 2023|
Ramesh Karri, New York University, Brooklyn, NY, USA, firstname.lastname@example.org
Qiaoyan Yu, University of New Hampshire, Durham, NH, USA, email@example.com